Advanced Power Cycling Test for Power Module with On-Line On-State VCE Measurement
Ui-Min Choi ; Ionut Trintis ; Frede Blaabjerg ; Søren Jørgensen ; Morten Liengaard Svarre
Reliability
,
Power cycling test
,
lifetime model
,
device test
Recent research has made an effort to improve the reliability of power electronic systems to comply with more stringent constraints on cost,…
Nanosilver Preform Assisted Die Attach for High Temperature Applications
Sayan Seal ; Michael D. Glover ; H. Alan Mantooth
Sintered silver
,
nanoparticles
,
die attach
,
preform
,
high temperature
In this paper, a technique has been explored in which preforms made of nanosilver particles have been fabricated and used for die…
Tackling Reliability of Power Module
Weikun Jimmy He ; Andras Vass-Varnai ; John Wilson
Thermal
,
Power
,
Packages
,
Structure
,
Reliability
,
Failure
,
Delamination
,
Degradation
,
Semiconductor
,
TIM
,
Thermal Interface Material
Structure function analysis made failure analysis on power module easier. Root cause of failure can be identified in minutes instead of days. …
